TIEplus 2021

Welcome to the 2021 edition of the TIEplus Signal and Power Integrity Challenge!

The diagram below describes the simplified architecture of a system that incorporates a camera interface connected to a video processing unit, implemented using an NXP processor.

Your task is to ensure the signal integrity of the camera video interface based on a dedicated MIPI CSI-2 camera link specification.

The system includes FR4 multi-layer PCBs and Polyimide based FPC for the flexible area.

Required skills:

  • S-parameter (Touchstone file) analysis and processing¬†
  • Loss budget planning
  • Full-wave solver extraction
  • Transient simulation
  • IO modeling
  • Crosstalk analysis
  • Eye diagram analysis
  • Stack-up design and material selection
  • Component selection for high speed signaling